SOLDER-PASTE PRINTING METHOD AND APPARATUS

PROBLEM TO BE SOLVED: To suppress increase in the viscosity of a solder paste which occurs during a solder-paste printing process. SOLUTION: A solder-paste printing apparatus 1 has a printing-oriented mask 10 having openings 10a each corresponding to each land 6 of a printed wiring board 5, and has...

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Bibliographische Detailangaben
Hauptverfasser:	SUZUKI MOTOHARU, SAKAI HIROSHI, TANAKA AKIHIRO, IGARASHI MAKOTO
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COLOUR PRINTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LINING MACHINES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS PRINTING PRINTING MACHINES OR PRESSES PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES STAMPS TRANSPORTING TYPEWRITERS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To suppress increase in the viscosity of a solder paste which occurs during a solder-paste printing process. SOLUTION: A solder-paste printing apparatus 1 has a printing-oriented mask 10 having openings 10a each corresponding to each land 6 of a printed wiring board 5, and has a squeegee 12 for rolling from one-side end of the mask 10 to the other-side end of the mask10 solder paste 11 which contains an Sn-Zn-based solder as a solder material and is mounted on the mask 10 mounted on the printed wiring board 5 while being aligned at a predetermined position of the board 5. Further, the solder-paste printing apparatus 1 has a moisture-content controlling means 2 for keeping the moisture content contained in the atmosphere of the inside of a printing space 1a surrounding the solder paste 11 not larger than a predetermined value. COPYRIGHT: (C)2004,JPO