COOLING UNIT FOR ELECTRONIC APPARATUS

PROBLEM TO BE SOLVED: To provide a cooling unit for an electronic apparatus that can enhance the heat exchange efficiency, prevent air-locking, and attain downsizing, weight reduction and a low profile with a simple structure at a low cost. SOLUTION: In the cooling unit for the electronic apparatus,...

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Hauptverfasser:	NIWATSUKINO YASUSHI, KASAHARA KAZUSHI, AIZONO MASAMITSU, NARAKINO SHIGERU, HIROSE MASASHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS BLASTING CALCULATING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COLD ROOMS COMBINED HEATING AND REFRIGERATION SYSTEMS COMPUTING COOLING OR FREEZING APPARATUS NOT COVERED BY ANY OTHERSUBCLASS COUNTING DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION ELECTRIC DIGITAL DATA PROCESSING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY HEAT EXCHANGE IN GENERAL HEAT PUMP SYSTEMS HEATING ICE-BOXES LIGHTING LIQUEFACTION SOLIDIFICATION OF GASES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MANUFACTURE OR STORAGE OF ICE MECHANICAL ENGINEERING PHYSICS PRINTED CIRCUITS REFRIGERATION OR COOLING REFRIGERATORS SEMICONDUCTOR DEVICES WEAPONS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a cooling unit for an electronic apparatus that can enhance the heat exchange efficiency, prevent air-locking, and attain downsizing, weight reduction and a low profile with a simple structure at a low cost. SOLUTION: In the cooling unit for the electronic apparatus, a radiator 1 is provided with a circulation path 6 configuring a closed circulation path. At least the circulation path 6 and a reserve tank 2 are formed as an internal space through butting by joining a flow passage wall 1a formed by integrating curved faces acting like a flow passage wall with a flow passage wall 1b of a flat shape other than the curved face by means of welding or the like. COPYRIGHT: (C)2004,JPO