APPARATUS AND METHOD FOR MOUNTING COMPONENT

PROBLEM TO BE SOLVED: To provide an apparatus and method for mounting components capable of suppressing lowering in the productivity of a board. SOLUTION: An electronic component mounting apparatus 100 comprising a moving head unit 4 having a plurality of nozzles 411 mounts a plurality of electronic...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	IWASAKI NOZOMI, OFUJI YUKARI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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