APPARATUS AND METHOD FOR MOUNTING COMPONENT

PROBLEM TO BE SOLVED: To provide an apparatus and method for mounting components capable of suppressing lowering in the productivity of a board. SOLUTION: An electronic component mounting apparatus 100 comprising a moving head unit 4 having a plurality of nozzles 411 mounts a plurality of electronic components 2 on a printed circuit board by repeating mounting processes for mounting electronic components sucked and held by the absorption nozzles of the head unit from a component supplying part 3 to predetermined positions on a printed circuit board 1. When it is determined that the mounting efficiency of an electronic component to the circuit board by a first determining means (e.g., a control part 10) as a result of a continuous mounting operation by a control means (e.g., a control means 10), without sucking the electronic components at the same time by two or more nozzles is decreased, a decrease in mounting efficiency is notified by means of a signal light 9. COPYRIGHT: (C)2004,JPO