INDUCTION HEATING DEVICE

PROBLEM TO BE SOLVED: To provide an induction heating device allowing reduction in the weight and cost of the device, and capable of preventing the overhang of a heat insulating board and the coming-off thereof caused by the generation of a crack due to a thermal shock. SOLUTION: The surface of the...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: ABE YUKIHISA, MATSUDA TSUYOSHI, TAKEWAKI KENJI, TERAJIMA HIDETOSHI, IMAEDA NOBUHIKO
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide an induction heating device allowing reduction in the weight and cost of the device, and capable of preventing the overhang of a heat insulating board and the coming-off thereof caused by the generation of a crack due to a thermal shock. SOLUTION: The surface of the induction heating device with the surface covered with the heat insulating board 2 is covered with a heat-resisting fiber material 3. It is also preferable that the fiber material 3 is wound around the surface, or fixed by a bolt or with an adhesive to cover the surface with the material. It is further also preferable that edges of the induction heating device are rounded so as to prevent the tear of the fiber material 3. COPYRIGHT: (C)2004,JPO