TOOL, APPARATUS, AND METHOD FOR SUPPLYING AND TAKING OUT SUBSTRATE

PROBLEM TO BE SOLVED: To provide a tool, an apparatus, and a method for supplying and taking out a substrate which are capable of supplying the substrate to a polishing pad and also taking it out through a vacuum suction without damaging the substrate nor making abrasives or abrasives wastes adhered...

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Bibliographische Detailangaben
Hauptverfasser:	FUJII TADASHI, NOMURA KATSUNORI, ARIMATSU YUJI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS BLASTING CONVEYING DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS ORMACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS,CLIPS, WEDGES, JOINTS OR JOINTING DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ENGINEERING ELEMENTS AND UNITS FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVEFUNCTIONING OF MACHINES OR INSTALLATIONS GRINDING HANDLING THIN OR FILAMENTARY MATERIAL HEATING INFORMATION STORAGE INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORDCARRIER AND TRANSDUCER LIGHTING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING MECHANICAL ENGINEERING PACKING PERFORMING OPERATIONS PHYSICS PNEUMATIC TUBE CONVEYORS POLISHING SEMICONDUCTOR DEVICES SHOP CONVEYOR SYSTEMS STORING THERMAL INSULATION IN GENERAL TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING ORTIPPING TRANSPORTING WEAPONS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a tool, an apparatus, and a method for supplying and taking out a substrate which are capable of supplying the substrate to a polishing pad and also taking it out through a vacuum suction without damaging the substrate nor making abrasives or abrasives wastes adhered on a substrate surface. SOLUTION: The supplying and taking out tool for a magnetic disk substrate 1 is equipped with a suction pad 3 made of a material made softer than the substrate and capable of containing water, and the suction pad 3 is made to abut against the substrate in a state that the suction pad 3 contains water, and the pressure of a vacuum suction part provided nearby a suction surface is reduced to make the suction pad suck the substrate across a water film 33, thereby supplying the substrate to a surface processing apparatus and taking it out of the surface processing apparatus. COPYRIGHT: (C)2004,JPO