SEMICONDUCTOR LIGHT EMITTING DEVICE

PROBLEM TO BE SOLVED: To improve the light guide-out efficiency of the top surface of a light emitting element of a semiconductor light emitting device, to make the device thin, to make the mechanical strength of a bonding part high, to obtain high productivity and yield, and further to stably obtain high conductivity. SOLUTION: Provided is a semiconductor light emitting element 1 which has a couple of electrodes 11 and 11' formed on the same surface side and a substrate 2 where wire electrodes 21 and 21' are formed. The semiconductor light emitting element 1 is mounted on the substrate 2 by interposing an anisotropic conductive adhesive 3 obtained by dispersing and mixing conductive spherical bodies 32 with a thermosetting resin 31 between a pair of the electrodes 11 and 11' and wire electrodes 21 and 21'.On the surfaces of the wire electrodes 21 and 21' which face the semiconductor light emitting element 1, recessed parts 22 and 22' are formed and the conductive spherical bodies 32 are made stably present between the pair of electrodes 11 and 11' and wire electrodes 21 and 21'. COPYRIGHT: (C)2004,JPO