SEMICONDUCTOR PACKAGE, MANUFACTURING METHOD THEREFOR, AND INSPECTION METHOD FOR SEMICONDUCTOR PACKAGE

PROBLEM TO BE SOLVED: To shorten inspection time without increasing the number of terminals for inspection. SOLUTION: This semiconductor package has a semiconductor chip mounted on an interposer 100 and a plurality of input/ output terminals 103. This semiconductor package is characterized by being...

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Hauptverfasser:	IKAWA KOHEI, UENO MASAHIRO, EGUCHI TOSHIYA, HAMA YUKARI, HASHINO HIROYOSHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PHYSICS SEMICONDUCTOR DEVICES TESTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To shorten inspection time without increasing the number of terminals for inspection. SOLUTION: This semiconductor package has a semiconductor chip mounted on an interposer 100 and a plurality of input/ output terminals 103. This semiconductor package is characterized by being equipped with a transmitting/ receiving coil 104 for transmitting and receiving inspection signals. A manufacturing method of the semiconductor package is provided. Transmission and reception of signals for inspection are performed by electromagnetic action via the transmitting/ receiving coil 104. COPYRIGHT: (C)2004,JPO