METHOD FOR MOLDING HIGH ELECTRICALLY CONDUCTIVE RESIN COMPONENT

PROBLEM TO BE SOLVED: To provide a high electrically conductive component excellent in corrosion resistance and also having sufficiently high electrical conductivity, in an electrically conductive resin component which is inexpensive and has the high degree of freedom for a shape. SOLUTION: In a met...

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Bibliographische Detailangaben
1. Verfasser:	SAGISAKA KOICHI
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BASIC ELECTRIC ELEMENTS CABLES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS CONDUCTORS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING INSULATORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS PRINTED CIRCUITS PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSIONOF CHEMICAL INTO ELECTRICAL ENERGY SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL WORKING-UP
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Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a high electrically conductive component excellent in corrosion resistance and also having sufficiently high electrical conductivity, in an electrically conductive resin component which is inexpensive and has the high degree of freedom for a shape. SOLUTION: In a method for carrying out injection molding of a thermoplastic resin composition containing a thermoplastic resin of 100 pts.wt. and a fine carbon fiber of 0.05-50 pts.wt. having an average fiber diameter of 100 nm or smaller, the thermoplastic resin composition is filled in a mold in which the temperature of a cavity surface is set from (Tc-50)°C to (Tm)°C to mold the high electrically conductive resin component, wherein Tc represents the crystallization temperature of the thermoplastic resin composition and Tm represents the melting point of the thermoplastic resin composition. COPYRIGHT: (C)2004,JPO