OPTICAL INTERCONNECTION EQUIPMENT

PROBLEM TO BE SOLVED: To provide optical interconnection equipment, which can further be miniaturized and can cope with a change of a circuit easily and the production cost of which can be reduced. SOLUTION: A face-emission semiconductor laser 21 and a driver IC 22 are three-dimensionally arranged w...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	YOSHIMURA TETSUZO, IBARAKI OSAMU, MIKAWA TAKASHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DEVICES USING STIMULATED EMISSION ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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