OPTICAL INTERCONNECTION EQUIPMENT

PROBLEM TO BE SOLVED: To provide optical interconnection equipment, which can further be miniaturized and can cope with a change of a circuit easily and the production cost of which can be reduced. SOLUTION: A face-emission semiconductor laser 21 and a driver IC 22 are three-dimensionally arranged w...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	YOSHIMURA TETSUZO, IBARAKI OSAMU, MIKAWA TAKASHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DEVICES USING STIMULATED EMISSION ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide optical interconnection equipment, which can further be miniaturized and can cope with a change of a circuit easily and the production cost of which can be reduced. SOLUTION: A face-emission semiconductor laser 21 and a driver IC 22 are three-dimensionally arranged with a sub-mount substrate 20a in between, and an LSI 23 for a CPU or the like is loaded on the driver IC 22. The face-emission semiconductor laser 21 is formed by an epitaxial lift-off (ELO) process, and is approximately 10 μm thick. Through holes are formed on the sub-mount substrate 20a, the face-emission semiconductor laser 21, the driver IC 22 and the LSI 23 respectively, and these parts are connected electrically through conductors in the through holes. COPYRIGHT: (C)2004,JPO