IC PACKAGED LAMINATE BODY STRUCTURE AND IC CARD

PROBLEM TO BE SOLVED: To provide a simple and inexpensive IC packaged laminate body structure which remarkably reduces a dynamic stress to an IC caused by adhesives and is adhered by the adhesives improved in insulation, heat resistance, durability, weather resistance and chemical resistance, and an...

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Bibliographische Detailangaben
Hauptverfasser:	SOMEMIYA TOSHIO, AIZAWA YUKIHIKO
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BOOK COVERS BOOKBINDING CALCULATING CHEMISTRY COMPUTING COUNTING DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDEDFOR DYES FILES HANDLING RECORD CARRIERS LOOSE LEAVES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS MOVABLE-STRIP WRITING OR READING APPARATUS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS PERFORMING OPERATIONS PHYSICS POLISHES PRESENTATION OF DATA PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITYFEATURES PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOTOTHERWISE PROVIDED FOR RECOGNITION OF DATA RECORD CARRIERS SPECIAL PRINTED MATTER TRANSPORTING USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a simple and inexpensive IC packaged laminate body structure which remarkably reduces a dynamic stress to an IC caused by adhesives and is adhered by the adhesives improved in insulation, heat resistance, durability, weather resistance and chemical resistance, and an IC card. SOLUTION: In the IC packaged laminate body structure in which two sheets are adhered by the adhesives while locating an IC unit between the two sheets, the adhesives contain, as essential components, (A): hydrocarbon polymer of molecular weight 500-300,000 having one or more alkenyl groups in molecules, (B): hardener, and (C): curing catalyst. COPYRIGHT: (C)2004,JPO