SHEET-LIKE CIRCUIT BOARD

PROBLEM TO BE SOLVED: To provide a bendable sheet-like circuit board and its manufacturing method wherein irregularities on the surface of a flexible board are reduced, moisture, gas and the like are prevented from penetrating into the flexible board, and circuit elements are prevented from varying...

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Bibliographische Detailangaben
Hauptverfasser:	NITTA TOSHIYA, METSUGI YASUKO, FUJIWARA TAKASHI, IMANAKA TAKASHI, ITOI SHINSUKE
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a bendable sheet-like circuit board and its manufacturing method wherein irregularities on the surface of a flexible board are reduced, moisture, gas and the like are prevented from penetrating into the flexible board, and circuit elements are prevented from varying in characteristics or deteriorating in reliability. SOLUTION: The circuit element composed of a capacitor 120 and a resistor 121 composing an electric circuit is formed on a flexible board 100 formed of an organic polymer. A first inorganic protective film 102 is interposed between the circuit element and the flexible board 100, and a second inorganic protective film 108 covers the circuit element. The first inorganic protective film 102 and the second inorganic protective film 108 are formed only in a region where the circuit element is formed. By this constitution, the inorganic protective films 102 and 108 are formed thick, and thus gas is prevented from penetrating the board 100, and furthermore the irregularities formed on the surface of the board 100 are made small. COPYRIGHT: (C)2004,JPO