METHOD FOR FORMING CONDUCTIVE CIRCUIT ONTO GLASS SUBSTRATE

PROBLEM TO BE SOLVED: To provide a method for forming a conductive circuit with a very thin width through gold plating onto a glass plate for a display panel by utilizing an electroless plating method so as to remarkably reduce the cost by developing the circuit pattern of the circuit by an optical...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: SAKAI YASUSABURO
Format: Patent
Sprache:eng
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