METHOD FOR FORMING CONDUCTIVE CIRCUIT ONTO GLASS SUBSTRATE

PROBLEM TO BE SOLVED: To provide a method for forming a conductive circuit with a very thin width through gold plating onto a glass plate for a display panel by utilizing an electroless plating method so as to remarkably reduce the cost by developing the circuit pattern of the circuit by an optical...

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Bibliographische Detailangaben
1. Verfasser:	SAKAI YASUSABURO
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FREQUENCY-CHANGING MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS NON-LINEAR OPTICS OPTICAL ANALOGUE/DIGITAL CONVERTERS OPTICAL LOGIC ELEMENTS OPTICS PHYSICS PRINTED CIRCUITS TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a method for forming a conductive circuit with a very thin width through gold plating onto a glass plate for a display panel by utilizing an electroless plating method so as to remarkably reduce the cost by developing the circuit pattern of the circuit by an optical lithography method. SOLUTION: The forming cost of the conductive circuit through gold plating and development of the circuit pattern according to the optical lithography means can be reduced by including silver oxide fine powder to a paste composition filmed on the glass substrate so as to accelerate decomposition of a binder polymer by a UV ray. COPYRIGHT: (C)2004,JPO