METHOD OF FORMING FOR PROJECTED ELECTRODE AND ITS EQUIPMENT

PROBLEM TO BE SOLVED: To suppress the height variations of the solder bumps even when they are made high. SOLUTION: The bumps 10 are reflow soldered by applying a centrifugal force F1 and cooled (Fig.2). A height limiting plate 14 having a solder repellant surface 141 is disposed in the height direction with a certain spacing h from the bumps 10 to reject the molten solder 12 which comes in contact. If a centrifugal force F1 is applied while the bumps 10 are still molten, the molten solder 12 changes its shape by extending and touches the surface 141, but the surface 141 repels the molten solder 12 and the solder can not stick to it. Solidifying the molten solder in this state makes the solder bumps 16 in a uniform height h (Fig.13). COPYRIGHT: (C)2004,JPO