CLASSIFICATION METHOD OF SUBSTRATE, MANUFACTURING METHOD OF ELECTRONIC COMPONENT, AND DIMENSION MEASURING METHOD OF SUBSTRATE

CLASSIFICATION METHOD OF SUBSTRATE, MANUFACTURING METHOD OF ELECTRONIC COMPONENT, AND DIMENSION MEASURING METHOD OF SUBSTRATE

PROBLEM TO BE SOLVED: To provide a classification method of substrates, which can improve the yield. SOLUTION: In a substrate 11 partitioned in a component effective region 13, which has a plurality of vertical and transverse division grooves 12 provided for dividing it into a plurality of component...

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Bibliographische Detailangaben
Hauptverfasser: IOKA MITSUO, HOSHITOKU SEIJI
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
RESISTORS
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a classification method of substrates, which can improve the yield. SOLUTION: In a substrate 11 partitioned in a component effective region 13, which has a plurality of vertical and transverse division grooves 12 provided for dividing it into a plurality of components and wherein an element of the component is formed inside the vertical and transverse division groove 12, and a dummy region 14, which is provided around the component effective region 13 and wherein an element of the component is not formed, the size between two parallel division grooves 12a facing each other positioned in an outermost part in the component effective region 13 is measured and the substrate 11 is divided into the measured size. COPYRIGHT: (C)2004,JPO