ONE-PACK MOISTURE CURING EPOXY RESIN COMPOSITION

PROBLEM TO BE SOLVED: To obtain a one-pack moisture curing epoxy resin composition having excellent storage stability, excellent quick curability of remarkably rapid rises in initial adhesive strength and mechanical strength which are performances incompatible with the storage storage and further ex...

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Bibliographische Detailangaben
Hauptverfasser:	SUZUKI KENTARO, ENDO TAKESHI, MATSUURA NOBUTERU, HORII KYUICHI, MITA FUMIO
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To obtain a one-pack moisture curing epoxy resin composition having excellent storage stability, excellent quick curability of remarkably rapid rises in initial adhesive strength and mechanical strength which are performances incompatible with the storage storage and further excellent curability at low temperatures. SOLUTION: The one-pack moisture curing epoxy resin composition comprises a ketimine compound obtained by reacting a carbonyl compound selected from the group consisting of diethyl ketone, di-n-propyl ketone, ethyl n-propyl ketone and n-butyl ethyl ketone with an amine compound having a primary amino group, and an epoxy resin. COPYRIGHT: (C)2004,JPO