ULTRASONIC CLEANING MODULE

PROBLEM TO BE SOLVED: To provide an improved module for avoiding some of the conventional problems, and to provide a method for cleaning a plurality of electronic packages. SOLUTION: An ultrasonic cleaning module and a method for cleaning singulated electronic packages are provided. The module compr...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	ALBERT SZE CHAK TONG, CHEUNG YIU MING
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CLEANING CLEANING IN GENERAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PERFORMING OPERATIONS PREVENTION OF FOULING IN GENERAL SEMICONDUCTOR DEVICES TRANSPORTING
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