ULTRASONIC CLEANING MODULE

PROBLEM TO BE SOLVED: To provide an improved module for avoiding some of the conventional problems, and to provide a method for cleaning a plurality of electronic packages. SOLUTION: An ultrasonic cleaning module and a method for cleaning singulated electronic packages are provided. The module compr...

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Bibliographische Detailangaben
Hauptverfasser:	ALBERT SZE CHAK TONG, CHEUNG YIU MING
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CLEANING CLEANING IN GENERAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PERFORMING OPERATIONS PREVENTION OF FOULING IN GENERAL SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an improved module for avoiding some of the conventional problems, and to provide a method for cleaning a plurality of electronic packages. SOLUTION: An ultrasonic cleaning module and a method for cleaning singulated electronic packages are provided. The module comprises a cutting chuck having a surface with a plurality of cutting recesses defined in it for enabling separation of individual electronic packages from a substrate having a plurality of electronic packages on the surface of the chuck. A pulsator nozzle is supported above the chuck and the separated electronic packages such that the nozzle may emit fluid toward the packages. An ultrasonic generator is associated with the nozzle that is adapted to ultrasonically energize fluid that passes through the nozzle to enhance cleaning of the packages. COPYRIGHT: (C)2004,JPO