SEMICONDUCTOR MANUFACTURING EQUIPMENT, POLISHING SOLUTION SUPPLY ARRANGEMENT, PROPERTY DETECTING METHOD OF POLISHING SOLUTION, AND MANUFACTURE OF SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To continuously maintain successful polishing properties by detecting variations in the polishing characteristics of a polishing solution. SOLUTION: Equipment for manufacturing a semiconductor device by polishing the surface of a semiconductor substrate comprises a polishing pa...

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Bibliographische Detailangaben
1. Verfasser:	SAKAI KATSUNAO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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Zusammenfassung:	PROBLEM TO BE SOLVED: To continuously maintain successful polishing properties by detecting variations in the polishing characteristics of a polishing solution. SOLUTION: Equipment for manufacturing a semiconductor device by polishing the surface of a semiconductor substrate comprises a polishing pad for polishing the substrate surface; a polishing solution supply means for supplying the polishing solution to the substrate surface; and a measuring instrument 18 including an electrode (A) 24 and an electrode (B) 25 dipped into the polishing solution 22. The measuring instrument 18 detects variations in the characteristics of the polishing solution 22 from the variations in the value of current flowing between the electrode (A) 24 and the electrode (B) 25 or the potential difference between the electrodes. COPYRIGHT: (C)2004,JPO