MOUNTED STRUCTURE OF ELECTRONIC COMPONENT

PROBLEM TO BE SOLVED: To provide a mounted structure of electronic components wherein modules generating no heat and components generating no heat are forced to receive no thermal effect from modules generating heat and components generating heat, and the modules are forced not to interfere with eac...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	SAKAMOTO YUZURU, SHIRATORI MASUO, TAKAYASU TETSUFUMI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a mounted structure of electronic components wherein modules generating no heat and components generating no heat are forced to receive no thermal effect from modules generating heat and components generating heat, and the modules are forced not to interfere with each other. SOLUTION: The components generating heat or the modules including the components generating heat are provided on one surface of a heat sink, and the components generating no heat or the modules configured out of the components generating no heat are provided on the other surface of the heat sink. COPYRIGHT: (C)2004,JPO