SEMICONDUCTOR PACKAGE, METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE AND METHOD FOR INSPECTING SEMICONDUCTOR PACKAGE

PROBLEM TO BE SOLVED: To provide a semiconductor package, a method for manufacturing a semiconductor package and a method for inspecting a semiconductor package wherein the number of inspection pads can be increased irrespective of kinds of package structures such as DIP, QFP and BGA, electrical inspection is easy, and inspection time can be reduced. SOLUTION: The semiconductor package 50 has inspection pads 404 by which electrical inspection is enabled on a sealed surface side which is an opposite side to terminals 101 for mounting, in a semiconductor package wherein a semiconductor chip is sealed. The method for manufacturing the semiconductor package is provided with a process wherein a semiconductor chip 2 which is provided with electrodes for inspection and electrodes for mounting is mounted on a substrate 1 having the terminals 101 for mounting, a process wherein metal bumps are electrically connected with the electrodes for inspection, and the electrodes for mounting are electrically connected with the terminals 101 for mounting, a process wherein resin sealing is performed in order to fix the semiconductor chip 2, an exposure process of the metal bumps, and a process for forming a metal pattern 402 which electrically connects the metal bumps and the inspection pads 404. In the method for inspecting the semiconductor package 50, a signal for inspection is transmitted and received from both a mounting surface side and an opposite surface side of the semiconductor package 50. COPYRIGHT: (C)2004,JPO