DISCHARGE PLASMA TREATMENT DEVICE AND DISCHARGE PLASMA TREATMENT METHOD

PROBLEM TO BE SOLVED: To enhance operation efficiency in a film forming step and an etching step by providing the etching step intermittently between the film forming steps. SOLUTION: This device comprises a conveying unit 1 for continuously conveying a plurality of trays 11 (11a to 11d) for mountin...

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Bibliographische Detailangaben
Hauptverfasser: YUASA MOTOKAZU, NAKAJIMA SETSUO
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To enhance operation efficiency in a film forming step and an etching step by providing the etching step intermittently between the film forming steps. SOLUTION: This device comprises a conveying unit 1 for continuously conveying a plurality of trays 11 (11a to 11d) for mounting substrates 5 for forming a film in one direction X, a plurality of sets of discharge plasma generation units 2 (2a, 2b and 2c) disposed on the conveying trays 11 opposing each other, and a control unit 3 for controlling the conveying unit 1 and the discharge plasma generation units 2. The control unit 3 controls at least the one discharge plasma generation unit 2 to perform an etching process for the trays 11b, 11d conveyed at fixed intervals without mounting the substrate 5, and also the discharge plasma generation unit itself is simultaneously etched. COPYRIGHT: (C)2004,JPO