PHOTOSENSITIVE RESIN COMPOSITION

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition excellent in high resolution, heat resistance, adhesion, electrical properties, thermal shock resistance, PCT resistance and electroless plating resistance required as a solder resist and an interlayer insulating material of a print...

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Bibliographische Detailangaben
Hauptverfasser:	NARITA KICHIHEI, ARIMITSU KOJI, KOUDA KAZUHIKO, ICHIMURA KUNIHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CINEMATOGRAPHY ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a photosensitive resin composition excellent in high resolution, heat resistance, adhesion, electrical properties, thermal shock resistance, PCT resistance and electroless plating resistance required as a solder resist and an interlayer insulating material of a printed wiring board and as an electroless plating resist and having good storage stability. SOLUTION: The photosensitive resin composition comprises a compound (A) having at least two epoxy groups in one molecule, a compound (B) having at least two phenolic hydroxyl groups, a photobase generator (C) and a base breeder (D) which is decomposed by the action of a base to generate a base derived from a urethane bond. COPYRIGHT: (C)2004,JPO