BUMP OF SEMICONDUCTOR CHIP AND METHOD OF MANUFACTURING THE SAME

PROBLEM TO BE SOLVED: To provide a bump of a semiconductor chip and a method of manufacturing the same. SOLUTION: The bump of the semiconductor chip comprises each of a plurality of bond pads 180 formed on the semiconductor chip 100, a conductive bump formed on each bond pad 180, and a sidewall insulation film 210' formed on the sidewall of the conductive bump. By forming the insulation film 210' in such a manner as to surround bump metal films 220 and 230, productivity is improved since short circuit does not occur even if a semiconductor device is highly integrated during a process of packaging the semiconductor chip 100 using a method such as COG and thereby a pitch of the bonding pads 180 is narrowed. COPYRIGHT: (C)2004,JPO