METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND METHOD FOR PACKAGING SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device which can determine simply that terminals formed in the semiconductor device are necessary or unnecessary, and only the necessary terminals can be connected with a circuit board in the case of mounting. SOLUTION: In an interposer 2 on which bare chips 1 are mounted, terminals 3 for mounting which are used when the bare chips 1 are mounted on the circuit board and terminals 4 for inspection which are used in an inspection process of the bare chips 1 are formed of solder balls. After the inspection of the bare chips, the solder balls of the terminals 4 for inspection are removed from the interposer 2, thereby reducing the number of terminals in the case of mounting, and simplifying wiring formation on the circuit board side and the layer constitution of the circuit board. COPYRIGHT: (C)2004,JPO