CIRCUIT CONNECTION MATERIAL AND METHOD OF MANUFACTURING CIRCUIT CONNECTION BODY USING THE SAME
PROBLEM TO BE SOLVED: To provide a circuit connection material which can prevent electrolytic corrosion due to the extended portion of a circuit connection body and will not generates failures in conductivity due to such galvanic corrosion, and to provide a method of manufacturing the circuit connec...
Gespeichert in:
Hauptverfasser: | , |
---|---|
Format: | Patent |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | PROBLEM TO BE SOLVED: To provide a circuit connection material which can prevent electrolytic corrosion due to the extended portion of a circuit connection body and will not generates failures in conductivity due to such galvanic corrosion, and to provide a method of manufacturing the circuit connection body using the same material. SOLUTION: There is provided a circuit connection material, which is a bonding agent including thermosetting resin for electrically connecting electrodes of substrates including circuit electrodes provided interposed by pressurization or heating process, by providing the bonding agent for circuit connection in between the substrates including circuit electrodes provided facingly. At the extending portion, the bonding agent is extended to the other circuit electrode from at least one circuit electrode, and the amount of chloride ions (Cl-) of the bonding agent of the protruded portion is 40 ppm or less. COPYRIGHT: (C)2004,JPO |
---|