BONDING APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
PROBLEM TO BE SOLVED: To improve the working efficiency in a bonding step by shortening the teaching time of a stage height in the bonding step. SOLUTION: A method for manufacturing a semiconductor device in a die bonding apparatus comprises the steps of measuring three three-dimensional coordinates...
Gespeichert in:
| Hauptverfasser: | , |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | NADAMOTO KEISUKE OKUBO TATSUYUKI |
| description | PROBLEM TO BE SOLVED: To improve the working efficiency in a bonding step by shortening the teaching time of a stage height in the bonding step. SOLUTION: A method for manufacturing a semiconductor device in a die bonding apparatus comprises the steps of measuring three three-dimensional coordinates by performing an operation for moving a bonding tool to the arbitrary position of a stage and landing the tool at three different positions (steps 101 to 105); calculating the tilt of the stage surface as a plane for passing the three three-dimensional coordinates (step 106); calculating a stage height Z at the positioning position (X, Y) as Z coordinates of an intersection of the Z-axis passing the position (X, Y) of the tool and the plane at following actual bonding time, controlling the lowering position of the tool, based on the height Z and the thickness of a tab or the chip of an object to be bonded. In this way, bonding using a suitable pressing force is performed. COPYRIGHT: (C)2004,JPO |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2003332363A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2003332363A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2003332363A3</originalsourceid><addsrcrecordid>eNrjZHB28vdz8fRzV3AMCHAMcgwJDVZw9HNR8HUN8fB3UXDzD1LwdfQLdXN0DgkNAikLdvX1dAZqCXUOAcq5uIZ5OrvyMLCmJeYUp_JCaW4GJTfXEGcP3dSC_PjU4oLE5NS81JJ4rwAjAwNjY2MjYzNjR2OiFAEAjJUsAA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>BONDING APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE</title><source>esp@cenet</source><creator>NADAMOTO KEISUKE ; OKUBO TATSUYUKI</creator><creatorcontrib>NADAMOTO KEISUKE ; OKUBO TATSUYUKI</creatorcontrib><description>PROBLEM TO BE SOLVED: To improve the working efficiency in a bonding step by shortening the teaching time of a stage height in the bonding step. SOLUTION: A method for manufacturing a semiconductor device in a die bonding apparatus comprises the steps of measuring three three-dimensional coordinates by performing an operation for moving a bonding tool to the arbitrary position of a stage and landing the tool at three different positions (steps 101 to 105); calculating the tilt of the stage surface as a plane for passing the three three-dimensional coordinates (step 106); calculating a stage height Z at the positioning position (X, Y) as Z coordinates of an intersection of the Z-axis passing the position (X, Y) of the tool and the plane at following actual bonding time, controlling the lowering position of the tool, based on the height Z and the thickness of a tab or the chip of an object to be bonded. In this way, bonding using a suitable pressing force is performed. COPYRIGHT: (C)2004,JPO</description><edition>7</edition><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES</subject><creationdate>2003</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20031121&DB=EPODOC&CC=JP&NR=2003332363A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20031121&DB=EPODOC&CC=JP&NR=2003332363A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>NADAMOTO KEISUKE</creatorcontrib><creatorcontrib>OKUBO TATSUYUKI</creatorcontrib><title>BONDING APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE</title><description>PROBLEM TO BE SOLVED: To improve the working efficiency in a bonding step by shortening the teaching time of a stage height in the bonding step. SOLUTION: A method for manufacturing a semiconductor device in a die bonding apparatus comprises the steps of measuring three three-dimensional coordinates by performing an operation for moving a bonding tool to the arbitrary position of a stage and landing the tool at three different positions (steps 101 to 105); calculating the tilt of the stage surface as a plane for passing the three three-dimensional coordinates (step 106); calculating a stage height Z at the positioning position (X, Y) as Z coordinates of an intersection of the Z-axis passing the position (X, Y) of the tool and the plane at following actual bonding time, controlling the lowering position of the tool, based on the height Z and the thickness of a tab or the chip of an object to be bonded. In this way, bonding using a suitable pressing force is performed. COPYRIGHT: (C)2004,JPO</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2003</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHB28vdz8fRzV3AMCHAMcgwJDVZw9HNR8HUN8fB3UXDzD1LwdfQLdXN0DgkNAikLdvX1dAZqCXUOAcq5uIZ5OrvyMLCmJeYUp_JCaW4GJTfXEGcP3dSC_PjU4oLE5NS81JJ4rwAjAwNjY2MjYzNjR2OiFAEAjJUsAA</recordid><startdate>20031121</startdate><enddate>20031121</enddate><creator>NADAMOTO KEISUKE</creator><creator>OKUBO TATSUYUKI</creator><scope>EVB</scope></search><sort><creationdate>20031121</creationdate><title>BONDING APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE</title><author>NADAMOTO KEISUKE ; OKUBO TATSUYUKI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2003332363A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2003</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>NADAMOTO KEISUKE</creatorcontrib><creatorcontrib>OKUBO TATSUYUKI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>NADAMOTO KEISUKE</au><au>OKUBO TATSUYUKI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>BONDING APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE</title><date>2003-11-21</date><risdate>2003</risdate><abstract>PROBLEM TO BE SOLVED: To improve the working efficiency in a bonding step by shortening the teaching time of a stage height in the bonding step. SOLUTION: A method for manufacturing a semiconductor device in a die bonding apparatus comprises the steps of measuring three three-dimensional coordinates by performing an operation for moving a bonding tool to the arbitrary position of a stage and landing the tool at three different positions (steps 101 to 105); calculating the tilt of the stage surface as a plane for passing the three three-dimensional coordinates (step 106); calculating a stage height Z at the positioning position (X, Y) as Z coordinates of an intersection of the Z-axis passing the position (X, Y) of the tool and the plane at following actual bonding time, controlling the lowering position of the tool, based on the height Z and the thickness of a tab or the chip of an object to be bonded. In this way, bonding using a suitable pressing force is performed. COPYRIGHT: (C)2004,JPO</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng |
| recordid | cdi_epo_espacenet_JP2003332363A |
| source | esp@cenet |
| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| title | BONDING APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-23T17%3A08%3A04IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=NADAMOTO%20KEISUKE&rft.date=2003-11-21&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJP2003332363A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |