BONDING APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To improve the working efficiency in a bonding step by shortening the teaching time of a stage height in the bonding step. SOLUTION: A method for manufacturing a semiconductor device in a die bonding apparatus comprises the steps of measuring three three-dimensional coordinates by performing an operation for moving a bonding tool to the arbitrary position of a stage and landing the tool at three different positions (steps 101 to 105); calculating the tilt of the stage surface as a plane for passing the three three-dimensional coordinates (step 106); calculating a stage height Z at the positioning position (X, Y) as Z coordinates of an intersection of the Z-axis passing the position (X, Y) of the tool and the plane at following actual bonding time, controlling the lowering position of the tool, based on the height Z and the thickness of a tab or the chip of an object to be bonded. In this way, bonding using a suitable pressing force is performed. COPYRIGHT: (C)2004,JPO