WAFER TREATMENT APPARATUS AND METHOD

PROBLEM TO BE SOLVED: To provide a wafer treatment apparatus and method in which a part of a surface of a wafer is uniformly and precisely treated with a treatment liquid. SOLUTION: A wafer treatment apparatus (1) or the like for treating a desired annular area on the surface of the wafer has treatment liquid feeding parts (8, 10, 50) for feeding the treatment liquid for treating the surface of a wafer (A) held to be rotated within an approximately horizontal plane to the desired annular area on a surface (A1) of the wafer. Each treatment liquid feeding part has an annular guide surface (50) extending to a peripheral edge near an inner peripheral edge located to face an inner peripheral edge of the desired annular area on the surface of the wafer such that the peripheral edge forms a most expanded diameter portion. The annular guide surface (50) is rotated concentrically with the wafer (A) and the treatment liquid is fed to the annular guide surface (50). COPYRIGHT: (C)2004,JPO