APPARATUS AND METHOD FOR INSPECTION DEFECT

PROBLEM TO BE SOLVED: To solve such a problem that, when the correlation between the result of a defect inspection and the result of an electric test are taken, much labor and time are required for a re-observation in order to improve the reliability of the correlation analysis. SOLUTION: This appar...

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Bibliographische Detailangaben
1. Verfasser:	SESHIMA KOICHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MEASURING MEASURING ANGLES MEASURING AREAS MEASURING IRREGULARITIES OF SURFACES OR CONTOURS MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS PHYSICS SEMICONDUCTOR DEVICES TESTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To solve such a problem that, when the correlation between the result of a defect inspection and the result of an electric test are taken, much labor and time are required for a re-observation in order to improve the reliability of the correlation analysis. SOLUTION: This apparatus 1 for inspecting defect is provided with an external appearance inspecting part 2 for inspecting the external appearance of a semiconductor wafer 4, a signal converting part 11 for converting an image signal obtained by photographing the semiconductor wafer 4 in the external appearance inspecting part 2 into a luminance signal, a defect detecting part 12 for detecting defects by using the luminance signal converted in the signal converting part 11, and a defect sorting part 13 for sorting the defects detected in the defect detecting part 12 according to the relative density of a circuit pattern in the surroundings of the defects. COPYRIGHT: (C)2004,JPO