CURABLE COMPOSITION FOR PRESSURE-SENSITIVE ADHESION AND PRESSURE-SENSITIVE ADHESIVE PREPARED BY CURING THE SAME

PROBLEM TO BE SOLVED: To provide a non-solvent type curable composition for pressure- sensitive adhesion as a raw material for forming a pressure-sensitive adhesive for a pressure-sensitive sheet having excellent peelability, heat resistance, stability with time, homogeneity and environmental resist...

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Bibliographische Detailangaben
Hauptverfasser:	KOMINAMI TAKESHI, TAKENAKA NAOKI
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BOOK COVERS BOOKBINDING CHEMISTRY DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDEDFOR DYES FILES LOOSE LEAVES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS MOVABLE-STRIP WRITING OR READING APPARATUS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS PERFORMING OPERATIONS POLISHES PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITYFEATURES PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOTOTHERWISE PROVIDED FOR SPECIAL PRINTED MATTER TRANSPORTING USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a non-solvent type curable composition for pressure- sensitive adhesion as a raw material for forming a pressure-sensitive adhesive for a pressure-sensitive sheet having excellent peelability, heat resistance, stability with time, homogeneity and environmental resistance. SOLUTION: The curable composition for pressure-sensitive adhesive comprises a urethane (meth)acrylate elastomer prepared by adding a hydroxy groups-bearing (meth)acrylate to a prepolymer from a polyester alcohol and an organic polyisocyanate, an epoxy (meth)acrylate resin and a (meth)acrylate monomer prepared by condensation between a saturated alcohol of 6-18 carbons and (meth)acrylic acid. COPYRIGHT: (C)2004,JPO