SEMICONDUCTOR DEVICE AND ITS SHIELDING METHOD

PROBLEM TO BE SOLVED: To provide a semiconductor device in which an electromagnetic shield can be formed conveniently and surely, while reinforcing a printed board simultaneously, without impeding high density packaging of electronic components and to provide a shielding method of the semiconductor device. SOLUTION: A shield pack 4 has a two layer structure consisting of an insulation layer 9 of a thermosetting resin material, e.g. a thermosetting resin film, and a metal layer 8 formed on the insulation layer 9 by depositing metal. The insulation layer 9 is cured in tight contact with the surface of a mounted component 2, a semiconductor component 3 and a printed board 1 and the metal layer 8 is grounded, i.e., connected with the ground part of the printed board 1, through contact with a ground connection terminal 5 penetrating the shield pack 4. The ground connection terminal 5 has a pointed part which breaks the shield pack 4 when the shield pack 4 is applied tightly to the surface of the printed board 1. COPYRIGHT: (C)2004,JPO