SUBSTRATE FOR ELECTRONIC PACKAGING

PROBLEM TO BE SOLVED: To provide a substrate for electronic packaging which satisfies features of low permittivity, thinness, and the like. SOLUTION: The substrate for electronic packaging uses a porous film mainly composed of a non-crystalline polyallylate having a glass transition temperature of 2...

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Bibliographische Detailangaben
Hauptverfasser:	HASHIZUME KIYOSHIGE, SADANOBU JIROU
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP WORKING-UP
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a substrate for electronic packaging which satisfies features of low permittivity, thinness, and the like. SOLUTION: The substrate for electronic packaging uses a porous film mainly composed of a non-crystalline polyallylate having a glass transition temperature of 260°C or higher for an insulating material. COPYRIGHT: (C)2004,JPO