ELECTRODE SUBSTRATE AND ELECTRODE

PROBLEM TO BE SOLVED: To provide an inexpensive electrode substrate causing no buckling and no fracture in the boundary area of a collecting part having no hole and a perforated part, possible to be further miniaturized and lightened, and possible to have a high performance, and an electrode using t...

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Bibliographische Detailangaben
Hauptverfasser: NOMI RYOICHI, TSUNEMATSU SHOICHI, SUENAGA SATORU, SETO HIROHISA
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide an inexpensive electrode substrate causing no buckling and no fracture in the boundary area of a collecting part having no hole and a perforated part, possible to be further miniaturized and lightened, and possible to have a high performance, and an electrode using this substrate. SOLUTION: In this electrode substrate, the collecting part 2 having no hole, the perforated part 4, and an intermediate part 3 between both parts where a perforation rate is gradually reduced from the perforation rate of the perforated part toward the zero perforation rate of the collecting part are formed on nickel foil of thicknesses of 8-30 μm, which is manufactured by an electrolytic deposition method. This electrode is formed by having a desired active material carried on the surface of the substrate. COPYRIGHT: (C)2004,JPO