MULTILAYER WIRING BASE MATERIAL, MULTILAYER WIRING BOARD, AND ITS MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To improve yield of multilayer wiring boards by laminating base materials for multilayer wiring with high-density. SOLUTION: A photosensitive resist layer 8, which has an opening part near a bias hole 7, is formed as a mask, and then the via hole 7 is filled with a conductive resin composite 9. With such a structure, the thickness of the filling film of the conductive resin composite 9 is controlled by the photosensitive resist layer 8, and the filling film can be formed so as to be smooth and thin. This allows a base material for multilayer wiring to be laminated with high- density. In addition, in filling with the conductive resin composite 9, portions other than near the via hole 7 are covered with the photosensitive resist, so that occurrence of defects, due to scattering of ink is prevented and yield of multilayer wiring boards, can be improved. COPYRIGHT: (C)2004,JPO