METHOD FOR DETACHING SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To remove a semiconductor device and an adhesive material from a circuit board without damaging the electrode wiring of the circuit board. SOLUTION: A resin material is arranged so as to cover the electrode wiring on the circuit board formed around the semiconductor device. By...

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Bibliographische Detailangaben
Hauptverfasser:	TAKAHASHI MASANORI, OUCHI TOSHIMICHI, NIIHORI KENJI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FREQUENCY-CHANGING NON-LINEAR OPTICS OPTICAL ANALOGUE/DIGITAL CONVERTERS OPTICAL LOGIC ELEMENTS OPTICS PHYSICS SEMICONDUCTOR DEVICES TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To remove a semiconductor device and an adhesive material from a circuit board without damaging the electrode wiring of the circuit board. SOLUTION: A resin material is arranged so as to cover the electrode wiring on the circuit board formed around the semiconductor device. By a repair tool having a plane part for which sides of the plane part are slightly larger than sides of the mounting surface of the circuit board of the semiconductor device and a projection is formed on at least one side of the plane part, a load in a direction parallel to the mounting surface of the circuit board is applied to the semiconductor. The semiconductor device is detached from the circuit board. COPYRIGHT: (C)2004,JPO