METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To make a semiconductor device thin in a method of manufacturing the semiconductor device in which a semiconductor chip is mounted on a wiring board by interposing an elastic body and in which the circumference of the semiconductor chip is sealed by a transfer molding operation...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: OKAMOTO AKIHIRO, KAMEYAMA YASUHARU, KOMIYA KAZUMOTO, KAWANOBE SUNAO, SHIBATA AKIJI
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator OKAMOTO AKIHIRO
KAMEYAMA YASUHARU
KOMIYA KAZUMOTO
KAWANOBE SUNAO
SHIBATA AKIJI
description PROBLEM TO BE SOLVED: To make a semiconductor device thin in a method of manufacturing the semiconductor device in which a semiconductor chip is mounted on a wiring board by interposing an elastic body and in which the circumference of the semiconductor chip is sealed by a transfer molding operation. SOLUTION: In the method of manufacturing the semiconductor device, the semiconductor chip is bonded to the wiring board by interposing an elastic body material in which wiring (a conductor pattern) passing the upper part of an opening is formed on an insulating board having the opening, a part passing the upper part of the opening in the wiring is cut so as to be bent, the part is connected electrically to an external electrode of the semiconductor chip, a connection part of the interconnection to the external electrode of the semiconductor chip is formed by using a molding metal mold, and a sealing insulator is formed around the elastic body material and the semiconductor chip. In the method of manufacturing the semiconductor device, the sealing insulator is formed in a state that the rear of a face on which the semiconductor chip is bonded to the wiring board and the rear of a face on which the semiconductor chip is bonded to the elastic body material are brought into contact with the molding metal mold. COPYRIGHT: (C)2004,JPO
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2003309138A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2003309138A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2003309138A3</originalsourceid><addsrcrecordid>eNrjZNDxdQ3x8HdR8HdT8HX0C3VzdA4JDfL0c1cIdvX1dPb3cwl1DvEPUnBxDfN0duVhYE1LzClO5YXS3AxKbq4hzh66qQX58anFBYnJqXmpJfFeAUYGBsbGBpaGxhaOxkQpAgDtxSW6</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE</title><source>esp@cenet</source><creator>OKAMOTO AKIHIRO ; KAMEYAMA YASUHARU ; KOMIYA KAZUMOTO ; KAWANOBE SUNAO ; SHIBATA AKIJI</creator><creatorcontrib>OKAMOTO AKIHIRO ; KAMEYAMA YASUHARU ; KOMIYA KAZUMOTO ; KAWANOBE SUNAO ; SHIBATA AKIJI</creatorcontrib><description>PROBLEM TO BE SOLVED: To make a semiconductor device thin in a method of manufacturing the semiconductor device in which a semiconductor chip is mounted on a wiring board by interposing an elastic body and in which the circumference of the semiconductor chip is sealed by a transfer molding operation. SOLUTION: In the method of manufacturing the semiconductor device, the semiconductor chip is bonded to the wiring board by interposing an elastic body material in which wiring (a conductor pattern) passing the upper part of an opening is formed on an insulating board having the opening, a part passing the upper part of the opening in the wiring is cut so as to be bent, the part is connected electrically to an external electrode of the semiconductor chip, a connection part of the interconnection to the external electrode of the semiconductor chip is formed by using a molding metal mold, and a sealing insulator is formed around the elastic body material and the semiconductor chip. In the method of manufacturing the semiconductor device, the sealing insulator is formed in a state that the rear of a face on which the semiconductor chip is bonded to the wiring board and the rear of a face on which the semiconductor chip is bonded to the elastic body material are brought into contact with the molding metal mold. COPYRIGHT: (C)2004,JPO</description><edition>7</edition><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2003</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20031031&amp;DB=EPODOC&amp;CC=JP&amp;NR=2003309138A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,778,883,25547,76298</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20031031&amp;DB=EPODOC&amp;CC=JP&amp;NR=2003309138A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>OKAMOTO AKIHIRO</creatorcontrib><creatorcontrib>KAMEYAMA YASUHARU</creatorcontrib><creatorcontrib>KOMIYA KAZUMOTO</creatorcontrib><creatorcontrib>KAWANOBE SUNAO</creatorcontrib><creatorcontrib>SHIBATA AKIJI</creatorcontrib><title>METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE</title><description>PROBLEM TO BE SOLVED: To make a semiconductor device thin in a method of manufacturing the semiconductor device in which a semiconductor chip is mounted on a wiring board by interposing an elastic body and in which the circumference of the semiconductor chip is sealed by a transfer molding operation. SOLUTION: In the method of manufacturing the semiconductor device, the semiconductor chip is bonded to the wiring board by interposing an elastic body material in which wiring (a conductor pattern) passing the upper part of an opening is formed on an insulating board having the opening, a part passing the upper part of the opening in the wiring is cut so as to be bent, the part is connected electrically to an external electrode of the semiconductor chip, a connection part of the interconnection to the external electrode of the semiconductor chip is formed by using a molding metal mold, and a sealing insulator is formed around the elastic body material and the semiconductor chip. In the method of manufacturing the semiconductor device, the sealing insulator is formed in a state that the rear of a face on which the semiconductor chip is bonded to the wiring board and the rear of a face on which the semiconductor chip is bonded to the elastic body material are brought into contact with the molding metal mold. COPYRIGHT: (C)2004,JPO</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2003</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNDxdQ3x8HdR8HdT8HX0C3VzdA4JDfL0c1cIdvX1dPb3cwl1DvEPUnBxDfN0duVhYE1LzClO5YXS3AxKbq4hzh66qQX58anFBYnJqXmpJfFeAUYGBsbGBpaGxhaOxkQpAgDtxSW6</recordid><startdate>20031031</startdate><enddate>20031031</enddate><creator>OKAMOTO AKIHIRO</creator><creator>KAMEYAMA YASUHARU</creator><creator>KOMIYA KAZUMOTO</creator><creator>KAWANOBE SUNAO</creator><creator>SHIBATA AKIJI</creator><scope>EVB</scope></search><sort><creationdate>20031031</creationdate><title>METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE</title><author>OKAMOTO AKIHIRO ; KAMEYAMA YASUHARU ; KOMIYA KAZUMOTO ; KAWANOBE SUNAO ; SHIBATA AKIJI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2003309138A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2003</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>OKAMOTO AKIHIRO</creatorcontrib><creatorcontrib>KAMEYAMA YASUHARU</creatorcontrib><creatorcontrib>KOMIYA KAZUMOTO</creatorcontrib><creatorcontrib>KAWANOBE SUNAO</creatorcontrib><creatorcontrib>SHIBATA AKIJI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>OKAMOTO AKIHIRO</au><au>KAMEYAMA YASUHARU</au><au>KOMIYA KAZUMOTO</au><au>KAWANOBE SUNAO</au><au>SHIBATA AKIJI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE</title><date>2003-10-31</date><risdate>2003</risdate><abstract>PROBLEM TO BE SOLVED: To make a semiconductor device thin in a method of manufacturing the semiconductor device in which a semiconductor chip is mounted on a wiring board by interposing an elastic body and in which the circumference of the semiconductor chip is sealed by a transfer molding operation. SOLUTION: In the method of manufacturing the semiconductor device, the semiconductor chip is bonded to the wiring board by interposing an elastic body material in which wiring (a conductor pattern) passing the upper part of an opening is formed on an insulating board having the opening, a part passing the upper part of the opening in the wiring is cut so as to be bent, the part is connected electrically to an external electrode of the semiconductor chip, a connection part of the interconnection to the external electrode of the semiconductor chip is formed by using a molding metal mold, and a sealing insulator is formed around the elastic body material and the semiconductor chip. In the method of manufacturing the semiconductor device, the sealing insulator is formed in a state that the rear of a face on which the semiconductor chip is bonded to the wiring board and the rear of a face on which the semiconductor chip is bonded to the elastic body material are brought into contact with the molding metal mold. COPYRIGHT: (C)2004,JPO</abstract><edition>7</edition><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_JP2003309138A
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-16T06%3A50%3A18IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=OKAMOTO%20AKIHIRO&rft.date=2003-10-31&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJP2003309138A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true