METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To make a semiconductor device thin in a method of manufacturing the semiconductor device in which a semiconductor chip is mounted on a wiring board by interposing an elastic body and in which the circumference of the semiconductor chip is sealed by a transfer molding operation. SOLUTION: In the method of manufacturing the semiconductor device, the semiconductor chip is bonded to the wiring board by interposing an elastic body material in which wiring (a conductor pattern) passing the upper part of an opening is formed on an insulating board having the opening, a part passing the upper part of the opening in the wiring is cut so as to be bent, the part is connected electrically to an external electrode of the semiconductor chip, a connection part of the interconnection to the external electrode of the semiconductor chip is formed by using a molding metal mold, and a sealing insulator is formed around the elastic body material and the semiconductor chip. In the method of manufacturing the semiconductor device, the sealing insulator is formed in a state that the rear of a face on which the semiconductor chip is bonded to the wiring board and the rear of a face on which the semiconductor chip is bonded to the elastic body material are brought into contact with the molding metal mold. COPYRIGHT: (C)2004,JPO