SILVER POWDER WITH HEAT RESISTANT METAL LAYER, SILVER PASTE USING THE SILVER POWDER, AND WIRING BOARD OBTAINED BY USING THE SILVER PASTE

PROBLEM TO BE SOLVED: To provide metal powder for forming a wiring conductor circuit, which can supply metal paste whose burnable temperature is higher than that of silver paste and which is more inexpensive than silver-palladium paste in the production of a wiring board, particularly a low temperature burned ceramic board, and to provide metal paste or the like. SOLUTION: This silver powder for forming the conductor circuit on the wiring board is provided with a heat resistant metal layer on the surfaces of powdery particles. The silver powder is obtained by forming the heat resistant metal layer of either one of nickel, a nickel alloy, cobalt or a cobalt alloy on the surfaces of the powdery particles of silver powder whose mean particle diameter D50by a laser diffraction scattering type particle size distribution measurement method is 0.05 to 10 μm. COPYRIGHT: (C)2004,JPO