FORMATION METHOD OF WATER-SOLUBLE RESIN FILM AND FORMATION METHOD OF FINE PATTERN USING THE SAME

PROBLEM TO BE SOLVED: To provide a formation method of a water-soluble resin covering for obtaining a fine pattern that has the controllability of a pattern dimension and request characteristics in satisfactory profiles and semiconductor devices in the fining of patterns particularly using water-sol...

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Bibliographische Detailangaben
Hauptverfasser: SUGATA YOSHIKI, NIIHORI HIROSHI
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a formation method of a water-soluble resin covering for obtaining a fine pattern that has the controllability of a pattern dimension and request characteristics in satisfactory profiles and semiconductor devices in the fining of patterns particularly using water-soluble covering formation agents, and to provide a method for forming the fine patterns using the formation method of the water-soluble resin films. SOLUTION: There are the formation method of the water-soluble resin films and the formation method of the fine patterns using the formation method of the water-soluble resin films. The formation method of the water-soluble resin films is used for forming the water-soluble resin films on an object to be coated by a rotary coating method, and includes: a process for increasing the rotational speed of the object to be coated to a specified high rotational speed during or after the drop of the water-soluble resin films formation agent to the object to be coated (a first process); a process for maintaining a specific high speed (a second process); a process for decreasing the speed from the specific high rotational speed to a specific low one (a third process); and a process for maintaining the specific low rotational speed (a fourth process). COPYRIGHT: (C)2004,JPO