SEMICONDUCTOR DEVICE, FIXING STRUCTURE THEREOF, AND METHOD FOR FIXING SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To suppress a reduction in life of a semiconductor to a temperature cycle and to use a semiconductor device even under the circumstance of strict vibration. SOLUTION: The semiconductor device is fixed to a cooling apparatus 4 and is provided with a semiconductor element 33, a r...

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Bibliographische Detailangaben
Hauptverfasser:	YOSHIDA TAKANOBU, NISHIBORI HIROSHI, KAMIGAI YASUMI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To suppress a reduction in life of a semiconductor to a temperature cycle and to use a semiconductor device even under the circumstance of strict vibration. SOLUTION: The semiconductor device is fixed to a cooling apparatus 4 and is provided with a semiconductor element 33, a radiation panel 2 which mounts the semiconductor element 33 and radiating heat generated at the semiconductor element 33, and a projecting part 7a which has a through hole for accepting a fixing screw to the cooling apparatus 4 by forming a gap between the radiation panel 2 and the cooling apparatus 4. By putting the fixing screw 9 to the through hole of the projecting part 7a to be screwed to the cooling apparatus 4, the semiconductor device is fixed to the cooling apparatus 4. COPYRIGHT: (C)2004,JPO