MANUFACTURING METHOD FOR RESIN PLATE

PROBLEM TO BE SOLVED: To provide a method for manufacturing a resin plate containing no air bubbles with good productivity. SOLUTION: In the method for manufacturing the resin plate by injecting a polymerizable raw material in a casting mold and heating the casting mold to polymerize and cure the po...

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Bibliographische Detailangaben
Hauptverfasser:	SHIMIZU MINORU, KURACHI YOSHIYA
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CHEMISTRY COMPOSITIONS BASED THEREON GENERAL PROCESSES OF COMPOUNDING MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL WORKING-UP
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a method for manufacturing a resin plate containing no air bubbles with good productivity. SOLUTION: In the method for manufacturing the resin plate by injecting a polymerizable raw material in a casting mold and heating the casting mold to polymerize and cure the polymerizable raw material, the casting mold is heated at the temperature T0°C in the temperature range of 30-50°C to set the polymerization ratio of the polymerizable raw material to 5 mass % or more and subsequently heated at a temperature of (T0-2)°C or lower. The polymerizable raw material to be injected is in a syrup-like state and heated at the temperature T0°C to set the polymerization ratio of the polymerizable raw material to 15 mass% or more, and the casting mold is next heated at a temperature of (T0-2)°C or lower. COPYRIGHT: (C)2004,JPO