RF-ID MEDIA AND METHOD FOR MANUFACTURING THE SAME

PROBLEM TO BE SOLVED: To easily form the gap of a fixed quantity between a base material and an IC module and to prevent an insulating film formed on the lower surface of the IC module from being broken and a circuit part in the IC module from coming into contact with an antenna to short-circuit eve...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: SUNAGA KOSUKE, SEKIHASHI MASAO
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator SUNAGA KOSUKE
SEKIHASHI MASAO
description PROBLEM TO BE SOLVED: To easily form the gap of a fixed quantity between a base material and an IC module and to prevent an insulating film formed on the lower surface of the IC module from being broken and a circuit part in the IC module from coming into contact with an antenna to short-circuit even when an external force is applied to the IC module. SOLUTION: In an area where neither a connection terminal 114 nor the antenna 112 is provided between the IC module 111 and a resin sheet 115, a spacer 113 is interposed which is thicker than the antenna 112 and thinner than the sum of the thickness of the antenna 112 and the length of the connection terminal 114. COPYRIGHT: (C)2004,JPO
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2003288559A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2003288559A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2003288559A3</originalsourceid><addsrcrecordid>eNrjZDAMctP1dFHwdXXxdFRw9AOxQjz8XRTc_IMUfB39Qt0cnUNCgzz93BVCPFwVgh19XXkYWNMSc4pTeaE0N4OSm2uIs4duakF-fGpxQWJyal5qSbxXgJGBgbGRhYWpqaWjMVGKAF0SJog</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>RF-ID MEDIA AND METHOD FOR MANUFACTURING THE SAME</title><source>esp@cenet</source><creator>SUNAGA KOSUKE ; SEKIHASHI MASAO</creator><creatorcontrib>SUNAGA KOSUKE ; SEKIHASHI MASAO</creatorcontrib><description>PROBLEM TO BE SOLVED: To easily form the gap of a fixed quantity between a base material and an IC module and to prevent an insulating film formed on the lower surface of the IC module from being broken and a circuit part in the IC module from coming into contact with an antenna to short-circuit even when an external force is applied to the IC module. SOLUTION: In an area where neither a connection terminal 114 nor the antenna 112 is provided between the IC module 111 and a resin sheet 115, a spacer 113 is interposed which is thicker than the antenna 112 and thinner than the sum of the thickness of the antenna 112 and the length of the connection terminal 114. COPYRIGHT: (C)2004,JPO</description><edition>7</edition><language>eng</language><subject>CALCULATING ; COMPUTING ; COUNTING ; HANDLING RECORD CARRIERS ; PHYSICS ; PRESENTATION OF DATA ; RECOGNITION OF DATA ; RECORD CARRIERS</subject><creationdate>2003</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20031010&amp;DB=EPODOC&amp;CC=JP&amp;NR=2003288559A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20031010&amp;DB=EPODOC&amp;CC=JP&amp;NR=2003288559A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SUNAGA KOSUKE</creatorcontrib><creatorcontrib>SEKIHASHI MASAO</creatorcontrib><title>RF-ID MEDIA AND METHOD FOR MANUFACTURING THE SAME</title><description>PROBLEM TO BE SOLVED: To easily form the gap of a fixed quantity between a base material and an IC module and to prevent an insulating film formed on the lower surface of the IC module from being broken and a circuit part in the IC module from coming into contact with an antenna to short-circuit even when an external force is applied to the IC module. SOLUTION: In an area where neither a connection terminal 114 nor the antenna 112 is provided between the IC module 111 and a resin sheet 115, a spacer 113 is interposed which is thicker than the antenna 112 and thinner than the sum of the thickness of the antenna 112 and the length of the connection terminal 114. COPYRIGHT: (C)2004,JPO</description><subject>CALCULATING</subject><subject>COMPUTING</subject><subject>COUNTING</subject><subject>HANDLING RECORD CARRIERS</subject><subject>PHYSICS</subject><subject>PRESENTATION OF DATA</subject><subject>RECOGNITION OF DATA</subject><subject>RECORD CARRIERS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2003</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDAMctP1dFHwdXXxdFRw9AOxQjz8XRTc_IMUfB39Qt0cnUNCgzz93BVCPFwVgh19XXkYWNMSc4pTeaE0N4OSm2uIs4duakF-fGpxQWJyal5qSbxXgJGBgbGRhYWpqaWjMVGKAF0SJog</recordid><startdate>20031010</startdate><enddate>20031010</enddate><creator>SUNAGA KOSUKE</creator><creator>SEKIHASHI MASAO</creator><scope>EVB</scope></search><sort><creationdate>20031010</creationdate><title>RF-ID MEDIA AND METHOD FOR MANUFACTURING THE SAME</title><author>SUNAGA KOSUKE ; SEKIHASHI MASAO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2003288559A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2003</creationdate><topic>CALCULATING</topic><topic>COMPUTING</topic><topic>COUNTING</topic><topic>HANDLING RECORD CARRIERS</topic><topic>PHYSICS</topic><topic>PRESENTATION OF DATA</topic><topic>RECOGNITION OF DATA</topic><topic>RECORD CARRIERS</topic><toplevel>online_resources</toplevel><creatorcontrib>SUNAGA KOSUKE</creatorcontrib><creatorcontrib>SEKIHASHI MASAO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SUNAGA KOSUKE</au><au>SEKIHASHI MASAO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>RF-ID MEDIA AND METHOD FOR MANUFACTURING THE SAME</title><date>2003-10-10</date><risdate>2003</risdate><abstract>PROBLEM TO BE SOLVED: To easily form the gap of a fixed quantity between a base material and an IC module and to prevent an insulating film formed on the lower surface of the IC module from being broken and a circuit part in the IC module from coming into contact with an antenna to short-circuit even when an external force is applied to the IC module. SOLUTION: In an area where neither a connection terminal 114 nor the antenna 112 is provided between the IC module 111 and a resin sheet 115, a spacer 113 is interposed which is thicker than the antenna 112 and thinner than the sum of the thickness of the antenna 112 and the length of the connection terminal 114. COPYRIGHT: (C)2004,JPO</abstract><edition>7</edition><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_JP2003288559A
source esp@cenet
subjects CALCULATING
COMPUTING
COUNTING
HANDLING RECORD CARRIERS
PHYSICS
PRESENTATION OF DATA
RECOGNITION OF DATA
RECORD CARRIERS
title RF-ID MEDIA AND METHOD FOR MANUFACTURING THE SAME
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-07T02%3A52%3A16IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=SUNAGA%20KOSUKE&rft.date=2003-10-10&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJP2003288559A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true