RF-ID MEDIA AND METHOD FOR MANUFACTURING THE SAME
PROBLEM TO BE SOLVED: To easily form the gap of a fixed quantity between a base material and an IC module and to prevent an insulating film formed on the lower surface of the IC module from being broken and a circuit part in the IC module from coming into contact with an antenna to short-circuit eve...
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creator | SUNAGA KOSUKE SEKIHASHI MASAO |
description | PROBLEM TO BE SOLVED: To easily form the gap of a fixed quantity between a base material and an IC module and to prevent an insulating film formed on the lower surface of the IC module from being broken and a circuit part in the IC module from coming into contact with an antenna to short-circuit even when an external force is applied to the IC module. SOLUTION: In an area where neither a connection terminal 114 nor the antenna 112 is provided between the IC module 111 and a resin sheet 115, a spacer 113 is interposed which is thicker than the antenna 112 and thinner than the sum of the thickness of the antenna 112 and the length of the connection terminal 114. COPYRIGHT: (C)2004,JPO |
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SOLUTION: In an area where neither a connection terminal 114 nor the antenna 112 is provided between the IC module 111 and a resin sheet 115, a spacer 113 is interposed which is thicker than the antenna 112 and thinner than the sum of the thickness of the antenna 112 and the length of the connection terminal 114. COPYRIGHT: (C)2004,JPO</description><edition>7</edition><language>eng</language><subject>CALCULATING ; COMPUTING ; COUNTING ; HANDLING RECORD CARRIERS ; PHYSICS ; PRESENTATION OF DATA ; RECOGNITION OF DATA ; RECORD CARRIERS</subject><creationdate>2003</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20031010&DB=EPODOC&CC=JP&NR=2003288559A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20031010&DB=EPODOC&CC=JP&NR=2003288559A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SUNAGA KOSUKE</creatorcontrib><creatorcontrib>SEKIHASHI MASAO</creatorcontrib><title>RF-ID MEDIA AND METHOD FOR MANUFACTURING THE SAME</title><description>PROBLEM TO BE SOLVED: To easily form the gap of a fixed quantity between a base material and an IC module and to prevent an insulating film formed on the lower surface of the IC module from being broken and a circuit part in the IC module from coming into contact with an antenna to short-circuit even when an external force is applied to the IC module. SOLUTION: In an area where neither a connection terminal 114 nor the antenna 112 is provided between the IC module 111 and a resin sheet 115, a spacer 113 is interposed which is thicker than the antenna 112 and thinner than the sum of the thickness of the antenna 112 and the length of the connection terminal 114. COPYRIGHT: (C)2004,JPO</description><subject>CALCULATING</subject><subject>COMPUTING</subject><subject>COUNTING</subject><subject>HANDLING RECORD CARRIERS</subject><subject>PHYSICS</subject><subject>PRESENTATION OF DATA</subject><subject>RECOGNITION OF DATA</subject><subject>RECORD CARRIERS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2003</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDAMctP1dFHwdXXxdFRw9AOxQjz8XRTc_IMUfB39Qt0cnUNCgzz93BVCPFwVgh19XXkYWNMSc4pTeaE0N4OSm2uIs4duakF-fGpxQWJyal5qSbxXgJGBgbGRhYWpqaWjMVGKAF0SJog</recordid><startdate>20031010</startdate><enddate>20031010</enddate><creator>SUNAGA KOSUKE</creator><creator>SEKIHASHI MASAO</creator><scope>EVB</scope></search><sort><creationdate>20031010</creationdate><title>RF-ID MEDIA AND METHOD FOR MANUFACTURING THE SAME</title><author>SUNAGA KOSUKE ; SEKIHASHI MASAO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2003288559A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2003</creationdate><topic>CALCULATING</topic><topic>COMPUTING</topic><topic>COUNTING</topic><topic>HANDLING RECORD CARRIERS</topic><topic>PHYSICS</topic><topic>PRESENTATION OF DATA</topic><topic>RECOGNITION OF DATA</topic><topic>RECORD CARRIERS</topic><toplevel>online_resources</toplevel><creatorcontrib>SUNAGA KOSUKE</creatorcontrib><creatorcontrib>SEKIHASHI MASAO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SUNAGA KOSUKE</au><au>SEKIHASHI MASAO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>RF-ID MEDIA AND METHOD FOR MANUFACTURING THE SAME</title><date>2003-10-10</date><risdate>2003</risdate><abstract>PROBLEM TO BE SOLVED: To easily form the gap of a fixed quantity between a base material and an IC module and to prevent an insulating film formed on the lower surface of the IC module from being broken and a circuit part in the IC module from coming into contact with an antenna to short-circuit even when an external force is applied to the IC module. SOLUTION: In an area where neither a connection terminal 114 nor the antenna 112 is provided between the IC module 111 and a resin sheet 115, a spacer 113 is interposed which is thicker than the antenna 112 and thinner than the sum of the thickness of the antenna 112 and the length of the connection terminal 114. COPYRIGHT: (C)2004,JPO</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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subjects | CALCULATING COMPUTING COUNTING HANDLING RECORD CARRIERS PHYSICS PRESENTATION OF DATA RECOGNITION OF DATA RECORD CARRIERS |
title | RF-ID MEDIA AND METHOD FOR MANUFACTURING THE SAME |
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