RF-ID MEDIA AND METHOD FOR MANUFACTURING THE SAME

PROBLEM TO BE SOLVED: To easily form the gap of a fixed quantity between a base material and an IC module and to prevent an insulating film formed on the lower surface of the IC module from being broken and a circuit part in the IC module from coming into contact with an antenna to short-circuit eve...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: SUNAGA KOSUKE, SEKIHASHI MASAO
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To easily form the gap of a fixed quantity between a base material and an IC module and to prevent an insulating film formed on the lower surface of the IC module from being broken and a circuit part in the IC module from coming into contact with an antenna to short-circuit even when an external force is applied to the IC module. SOLUTION: In an area where neither a connection terminal 114 nor the antenna 112 is provided between the IC module 111 and a resin sheet 115, a spacer 113 is interposed which is thicker than the antenna 112 and thinner than the sum of the thickness of the antenna 112 and the length of the connection terminal 114. COPYRIGHT: (C)2004,JPO