METHOD FOR MANUFACTURING BOARD FOR FORMING CIRCUIT

PROBLEM TO BE SOLVED: To reduce warpage of a board for forming a circuit by the heat when soldering, and which has been a big problem for the board for forming a circuit when chip components are surface-mounted at a high density. SOLUTION: After the completion of a layer laminating process and a circuit forming process, a heat treatment process for heating and pressurizing at a temperature higher than in the layer stacking process and at a pressure lower than in the layer stacking process is introduced. In this way, the application of heat and pressure in the layer stacking process can be performed under the conventional conditions and the amount of warpage of the board at the time of soldering can be reduced. COPYRIGHT: (C)2004,JPO