SEMICONDUCTOR DEVICE USING SEMICONDUCTOR CHIP

PROBLEM TO BE SOLVED: To provide a semiconductor device that can be reduced in size and weight or is capable of using a large semiconductor chip, which is composed of one metal plate lead terminal 2 provided with a square island 3, the square semiconductor chip 4 bonded to the island 3 with a die bonding agent 7, the other metal plate lead terminal 5 electrically connected to the semiconductor chip 4, and a synthetic resin molded body 6 packaging the semiconductor chip 4. SOLUTION: The length and the width of the square land 3 are set 0.65 to 1.35 times as large as those of the semiconductor chip 4, so that the semiconductor chip 4 can be automatically corrected for position by the surface tension of the die bonding agent so as to make its side faces parallel or nearly parallel with those of the square island 3 and accurately positioned at the center of the island. COPYRIGHT: (C)2004,JPO