COOLING PLATE

PROBLEM TO BE SOLVED: To provide a ceramics cooling plate that has a heat emission property to keep a wafer at constant temperature and prevent thermal deformation during exposure as well as high rigidity and low thermal expansion factor for high processing accuracy. SOLUTION: The cooling plate hole...

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Bibliographische Detailangaben
1. Verfasser:	YOSHITOMI YASUKI
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a ceramics cooling plate that has a heat emission property to keep a wafer at constant temperature and prevent thermal deformation during exposure as well as high rigidity and low thermal expansion factor for high processing accuracy. SOLUTION: The cooling plate holes a vacuum chuck for fixing a wafer, and it is made of ceramics base material whose thermal conductivity is 10 W/K m or higher, thermal expansion factor between 0 and 50°C is 7×10-6/°C or lower, and Young's modulus is 200 GPa, and then it is provided with a vacuum suction route and a coolant route therein. COPYRIGHT: (C)2004,JPO