SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide an electrode structure for a bonding pad, which is provided with a sufficiently large allowable current and improved so that cracks are not generated in an insulation film between layers by mechanical stress upon wire bonding. SOLUTION: The insulation films 2a, 2b ar...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	NOZAKI MASAHIKO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!